Metal 3D IC Chip BGA Reballing Solder Template Stencil Tin Plate Reapir Tool for iPhone 6S/7Plus
1. The stepped grooves can quickly adjust the tin sweating location of IC beads.
2. The square hole position makes the tin bead form easier to remove.
3. No matter new or professional, this 3D Reballing Solder is easy to handle.
4. The success rate of Stencil Tin is high, and after being started, it is basically formed once.
5. Uniform heating, easy deformation and long service life.
Model: A8, A9, A10, A11
Compatible model: for iPhone 6S/7Plus
Please allow 1-3mm differs due to manual measurement.
Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understanding.
1 x Solder Template Stencil Tin Plate